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Magazine Name : Metal Finishing

Year : 2003 Volume number : 101 Issue: 01

Pure Matte Tin, Tin-Silver, Tin-Bismuth, And Tin-Copper Electrodeposits For Lead-Free Coatings Are Evaluated (Article)
Subject: Electronics , Lead-Free Solder , Alloy Electrodes
Author: M Jordan     
page:      08 - 08
Coating Plastics With Nonstorichiometric Copper Sulfide To Facilitate Copper Electroplating: Electrochemical Prerequisites (Article)
Subject: Coating Of Fabrics , Plastics , Copper Electroplating
Author: L. I. Stepanova     
page:      18 - 18
Review Options, Such As Immersion Tin, Immersion Silver, Electroless Nickel/Immersion Gold, And Immersion Gold Over Copper As Final Finishes For Printed Circuit Boards (Article)
Subject: Final Finish , Printed Circuit Board
Author: Walsh, D. E. Et Al     
page:      25 - 25
Study The Composition, Crystal Structure, And Surface Roughness Of Electrodeposited Gold Copper Cadmium Alloys Using Eds, Xrd, And Laser Interferometry, And Determine The Mechanical Properties (Article)
Subject: Electronics , Tribological Study , Electrodeposited , Gold-Copper-Cadmium
Author: Bozzini, B Et Al     
page:      42 - 42
Problem Solving Revisited (Article)
Subject: Quality Control
Author: Lasile W. Flott     
page:      57 - 62
Voc Measurement And Certification Of Spray Booths (Article)
Subject: Environmental Coating Problems
Author: Ron Joseph     
page:      63 - 64
Quality Management I (Statistics 1) (Article)
Subject: Cleaning Times
Author: John B. Durkee     
page:      65 - 65